8 Layer HASL Process Rigid Flex PCB :
An 8-layer HASL (Hot Air Solder Leveling) Rigid-Flex PCB is an advanced hybrid circuit board integrating eight conductive layers within a unified structure of rigid and flexible polyimide substrates. It leverages rigid sections for component mounting and complex circuitry, interconnected by dynamic flexible layers that enable 3D folding and bending. The HASL surface finish—applied by coating exposed copper with molten tin-lead or lead-free alloy followed by hot air leveling—provides cost-effective solderability, oxidation resistance, and robust shelf life. This architecture delivers ultra-high density (enabling complex HDI designs), exceptional mechanical resilience under repeated stress, space/weight savings exceeding 50% versus traditional rigid boards with connectors, and enhanced signal integrity in high-frequency applications.
Features:
| High Density |
The multilayer design allows for high component density, making it suitable for complex electronic systems. |
| Reliability |
The combination of rigid and flexible sections enhances durability and reliability, especially in dynamic environments. |
| Thermal Management |
Multiple layers can be designed to improve heat dissipation and manage thermal performance. |
| Solderability |
The tin-spray finish ensures good solderability and protects the copper traces from oxidation. |
Support and Services:
Our team of experts is dedicated to providing comprehensive technical support and services for our Rigid Flex PCB product. Whether you have questions about design specifications, manufacturing processes, or troubleshooting issues, we are here to assist you every step of the way. Our goal is to ensure that your Rigid Flex PCBs meet your expectations and requirements, delivering high-quality performance for your applications.
Difficulties in making rigid-flex PCBs
1.Flexible Section Challenges Material fragility: Thin, flexible substrates require specialized handling (e.g., carrier boards for horizontal processing) to prevent damage or misalignment .
2.Chemical sensitivity: Polyimide materials are incompatible with strong alkalis, necessitating adjusted process parameters for desmearing and blackening .
3.Lamination stability: Flexible layers exhibit poor dimensional stability, requiring controlled lamination conditions and specialized padding materials (e.g.,polypropylene films) to ensure adhesion .
4. Rigid Section Challenges Stress management: Inconsistent glass fabric orientation and thermal stress during pressing can cause warping or delamination .
5.Dimensional control:Shrinkage/expansion variations in flexible materials demand pre-compensation in rigid section fabrication .
6.Via processing: Flexible layer window machining requires precise timing and parameter control to balance weld integrity and foldability .
7.Integration Challenges Layer alignment: Hybrid FPC/PCB production necessitates precise registration between flexible and rigid layers, often using OPE- punched tooling .
8.Quality control: High-value assemblies require 100% inspection due to complex process flows and low yield rates .
9.Process integration: Conflicting requirements between flexible (e.g., NOFLOW prepregs) and rigid (e.g., standard FR-4) materials complicate lamination and drilling .
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8 Layer Rigid Flex PCB HASL Surface Treament FR4 Material Customized Size Images
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