Black Oil Dual Sided PCB OSP Treament Customized for Electronic Device Board

1. Dual-Sided Copper Cladding: Conductive copper foil on both top and bottom of the insulating substrate.
2. Plated Through-Holes (PTHs): Enable electrical connection between the two copper layers for signal/current transmission.
3. Balanced Performance-Cost: Higher component density and routing flexibility than single-sided PCBs, yet more cost-effective than multi-layer PCBs.
4. Moderate Component Density: Supports more components (e.g., SMDs, through-hole parts) than single-sided PCBs, suitable for devices needing moderate functional integration without the complexity of multi-layer boards.
5. Flexible Routing: Reduces wire crossing issues via two-layer routing, simplifying the layout of signal and power circuits for better performance.
6. Wider Application Adaptability: Compatible with diverse electronic devices across consumer, industrial, automotive, and medical fields due to its balanced cost and functionality.

Common applications​
● Telecom & Networking: Base stations, routers, and communication modules.
● Medical Devices: Portable instruments, monitors, and wearable tech.
● Industrial Control: PLCs, sensors, power modules, and automation systems.
● Consumer Electronics: Printers, home appliances, computers, and instruments.
● Automotive Electronics: ECU, lighting control, dashboards, and charging units.
● Aerospace & Defense: UAVs, communication terminals, and sensor boards.
● Emerging Tech: HDI designs for IoT, embedded systems, and high-density modules.

• Reliable solderability: The OSP film is easily removed during soldering, enabling good solder wetting on copper surfaces, reducing cold solder joint risks, and ensuring stable connections even for fine-pitch components.​

• Superior light-shielding and protection: The black solder mask provides effective light-shielding, preventing light interference in sensitive circuits; it also isolates circuits from external environments, enhancing corrosion and abrasion resistance.​

• Cost-effectiveness: Combining the low-cost OSP process with economical black ink and standard substrates, the PCB has controllable production costs, suitable for cost-sensitive fields like consumer electronics and home appliances.​

• Environmental friendliness: The OSP process uses non-toxic organic compounds, and the black ink is generally environmentally friendly, complying with environmental regulations and reducing hazardous waste.
• ​Dimensional precision: The thin OSP layer and black ink do not significantly affect the board’s thickness or flatness, making it suitable for high-density circuit designs requiring precise dimensions.